Issue 15

[14 [15 [16 [17 [18 [19 [20 [21 [22 ] M. I. Sakri, ] Y. Wang, K ] D. Yu, J. B Reliab, Arti ] T. Y. Tee, J ] T. Y. Tee, J 1094. ] J. E. Luan, Technologi ] C. –Y. Cho (2008)1149. ] J. Bai, F. Qi ] D. Radaj, M S. Saravanan . H. Low, H. . Kwak, S. Pa cle in Press (2 . Luan, E. Pe . Luan, E. P T. Y. Tee, E es, 29 (2006) u, T. –Y. H n, T. An, In: . Vormwald, , P. V. Mohan L. J. Pang, K rk, J. Lee, D 010). k, C. T. Lim, ek, C. T. Li . Pek, C. T 449. ung, S. –Y. Internationa Ermüdungs P. F. Fuchs et ram, Int. J. C . H. Hoon, F ynamic resp Z. Zhong, E m, Z. Zhong . Lim, Z. Zh Yang, M. –C l Conference festigkeit Gru alii, Frattura ed omput. Met . X. Che, Y. onses of PCB uroSimE200 , In: Electro ong, J. Zho . Yew, W. – on Electroni ndlagen für Integrità Struttu hods Eng. Sc S. Yong, Mic under prod 4, (2004) 133 nic Compon u, EEE Tran K. Yang, K cs Packaging Ingenieure, S rale, 15 (2011) i. Mech., 9 (2 roelectron R uct-level free . ents and Te sactions on . –N. Chiang Technology pringer, Berl 64-73; DOI : 10 008) 138. eliab., 46 (20 drop impac chnology Co Component , Microelec , (2007) 187. in Heidelberg .3221/IGF-ESIS. 06) 558. t, Microlelect nference, (20 s and Packag tron Reliab., (2007). 15.07 73 ron 04) ing 48: