Issue 15

P. F 72 stat goo Fin     In Th sim Th fail pre A C and the R E [1] [2] [3] [4] [5] [6] [7] [8] [9] [10 [11 [12 [13 T . Fuchs et alii, F istical evalua d approach ally, the follo The BLCBT times depen BLDT. In differences i The BLCBT by default. I testing spac impact ener The BLCBT displacemen The BLCBT Simulations challenging acceleration future analy erefore, BLC ulations are p us, having th ure stress ov diction of th KNOWLEDG he resea Austria) Technol the Austria State Gover FERENCES E. H. Wong JEDEC Sta (2003). E. H. Wong 139. J. Luan, T. Y S. K. W. Sh technology E. H. Wong Leoni, Y. –S J. L. Rodger X. Qu, Z. C G. Heaslip, ] D. Y. R. Ch ] P. L. Tu, Y. ] W. H. Zhu Component ] O. Beucher rattura ed Integ tion based o of the two m wing advant testing time ds on the bo our case the s an approxim can be perf n contrast th e. Furthermo gy, an adjustm can be perf t and frequen can be si of the BLD [14, 16]. The signal is app sis it is plan BT will be p lanned. e local failure er the numb e PCB fatigu EMENTS rch work o within the ogy with con Technologie nments of St , S. K. W. Se ndard JESD2 , S. K. W. Se . Tee, E. Pe ea, E. H. W conference, ( , S. K. W. Se . Lai, C. –L. s, W. A. Nic hen, B. Qi, T J. M. Punch, ong, H. J. To C. Chan, K. , J. H. L. Pa s and Techn , Wahrschein rità Strutturale, n a two-para ethods. ages of the B is significan ard perform BLCBT w ate break o ormed consi e BLDT und re, in the BL ent to prede ormed on b cy. mulated at T are difficu simplest wa lied directly t ned to gene erformed at stresses in d er of cycles. T e behaviour. f this paper framework tributions by & Systemtec yria and Upp ah, V. P. W. 2-B111, Boa ah, W. D. va k, C. T. Lim, ong, Y.-W. 2006) 1003– ah, C. S. Selv YEH, J. Ele ewander, The . Lee, J. Wan Electronic a h, B. K. Lim C. Hung, J. K ng, X. R. Zh ology Confer lichkeitsrech 15 (2011) 64-7 meter Weibu LCBT over t tly shorter th ances. The b as about two f 5 seconds b dering differ er temperatu DT only the fined amplit asically every lower compu lt, as the lo y to simulate o the board, rate Wöhler different def ependence o his resulting was perform of the Kplu the Institut hnik Aktieng er Austria. Shim, Micro rd Level Dro n Driel, J. F. Z. Zhong, M Mai, R . Raj 8 anayagam, R ctron. Mater American S g, Microelec nd Photonic , P. T. H. Lo . L. Lai, Mic ang, E. Poh ence, (2008) nung und Sta 3; DOI : 10.3221 ll distributio he BLDT co an the BLD etter a boar times faste etween each ent influence re influence i initial ampli udes is difficu dynamic tes ting times ad applicatio the BLDT i which is still curves [22] lection levels f the PCB be Wöhler cur ed at the P s-program o e of Material esellschaft. T electron Relia p Test Meth J. M. Caers, icroelectron oo, C. T. Lim . Rajoo, W. ., 38 (2009) 8 tatistician, 42 tron Reliab., Packaging, 3 w, In: Electr roelectron R , Y. F. Sun, 1667. tistik mit Ma /IGF-ESIS.15.07 n was perfor uld be identif T testing tim d performs, r than the drop in the B parameters s costly, as th tude can be c lt. The frequ ting machine than the BL n and the d s the ‘Input- computation to evaluate . To determi nding amplit ves should h olymer Com f the Austr Science and he PCCL is b., 48 (2008) od of Comp N. Owens, Y Reliab., 47 (2 , In: Procee D. Driel, J. F 84. (1) (1988) 59 47 (2007) 21 (2003) 125. onics Packagi eliab., 41 (20 A. Y. S. Sun tlab. Springer med. The st ied: e (The facto the faster is BLDT. The LDT.) (e.g. tempera e temperatur ontrolled. A ency in BLD which is ca DT using t efinition of G method’ [ ally expensiv the fatigue ne the acting udes, it woul elp to impro petence Cen ian Ministry Testing of P funded by t 1747. onents for H . –S. Lai, Mi 007) 450. dings of 56 t . J. M. Caers . 97. ng Technolo 01) 287. , C. K. Wan , Berlin Heid atistical resul r between th the BLCBT reason for ture, frequen e has to be a s this is done T can hardly pable of app he Finite E the boundar 13, 17, 18, 2 e. behaviour o local stresse d be possible ve the under ter Leoben of Traffic, lastics, Univ he Austrian G andheld Elec croelectron R h electronic , X. J. Zhao, gy Conferen g, H. B. Ta elberg, (2005 ts supported e method tes compared to the testing t cy or amplitu pplied on a l by adapting be varied at lying the des lement Meth y conditions 0, 21]) , where f PCB desi s, finite elem to plot the l standing and GmbH (PC Innovation ersity of Leo overnment tronic Produ eliab., 49 (20 components N. Owens, L ce, (2005) 26 n, In: Electro ). the ting the ime de) arge the all. ired od. are an gns. ent ocal the CL, and ben and cts, 09) and . C. 2. nic