Issue 15

Th mic exp T H Th as uns Th app par Wh Y M On ana e fracture tou ro-chevron- erimental de EORY he analy width w of 10 m e height of th well as the tructured ch e bonded chi roximately t ameters widt IC K  ile the maxi IN is determin e possibility lysis. With ghness is on specimen, the termination c sed samples and thicknes m, Fig. 1. e specimen d structure hei ip varies for d Figu p is loaded p o a Mode I h and thickn MAX MIN F Y t w   mum force F ed by FE-sim to estimate th an extension e of the suita fracture tou an be execut consist of tw s t are equal epends on t ght, Fig. 2. ifferent mat re 1 : Geometr Figure 2 : Mic erpendicular crack open ess by MAX can be ulation. e stress inten of the cra K. Vogel et ble values to ghness of th ed by combin o single chi [9, 10]. The he height of While the h erial combina y of a micro-ch ro-chevron-sp to the x-y-pl ing. So the measured du sity coefficie ck length, t alii, Frattura ed describe the is specimen c ing experim ps bonded to analysis is fo the unstructu eight of the tions. evron-specim ecimen prepa ane in front fracture toug ring a tensil nt is the com he complian Integrità Struttu damage beha an be determ ent with num gether. Beca cused on spe red wafer h w1 structured en compared red from a pro of the sharp hness K IC c e test, the m pliance meth ce of the s rale, 15 (2011) viour of the ined numeri erical analysi use they hav cimens with and the heig chip is kept to an one cent cessed wafer. notch. The li an be calcul inimum of t od. It comb pecimen inc 21-28; DOI: 10 bonded inter cally and exp s. e a quadrati both a width ht of the stru constant, th coin. fting of the c ated against he stress inte ines experim reases too. .3221/IGF-ESIS. face. Based o erimentally. c footprint, t and a thickn ctured wafer e height of rack fronts le the geomet (1) nsity coeffic ent with num By keeping 15.03 23 n a The heir ess h w2 the ads rical ient eric the