Lehr, M.U.
-
ICF12, Ottawa 2009 - Fracture Processes and Reliability In Micro- and Nanoelectronics, Geophysics & Tectonics, Fracture Of Membranes
Crack and delamination Risk Evaluation in low-k BEol
Abstract
PDF
-
CP2009 - General Papers
Crack and Damage Evaluation in low-k Interconnect Structuresunder Chip Package Interaction Aspects
Abstract
PDF
This work is licensed under a
Creative Commons Attribution 3.0 License.