Digital Repository, ICF12, Ottawa 2009

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Detection and analysis of fracture initiation in microelectronic packages using methods of digital speckle correlation and fiber Bragg grating
Hua Lu, Ming Zhou, Xijia Gu

Last modified: 2013-05-06


Onset fracture detection is the key of a novel hybrid approach for the reliability assessment of advanced microelectronics. Focusing on structurally weak yet functionality-wisely critical sites such as the solder and multi-material interconnects, the approach employs some microscopic deformation measurement techniques such as Digital Speckle Correlation and Fiber Bragg Grating sensor. Case applications presented to illustrate the new approach involve a radio frequency power amplifier assembly and a large area array package with 2809 solder joints. In both applications the packages’ reliability sensitive sites were identified, followed by mechanical and thermal tests aimed to measure deformation parameters in these sites. Assisted by visual failure inspections, the data analysis pinpointed the temperature/time instant the fracture initiated, which made possible to determine the package’s failure critical load or condition.

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